Reducing Thermal Bridging in Wall to Floor Junction Designs 2023

Description

Since the demise of Accredited Construction Details and the requirement in building regulations to provide a calculated assessment of non-repeating thermal bridges in all submissions in SAP and SBEM, designers need to be aware of what options are available how this new process is carried out.

This seminar outlines the problems of thermal bridging in junction design, particularly at the wall to floor junction and details what needs to be done to achieve compliance with Part L (England + Wales) or Section 6 (Scotland) of the building regulations/standards. It examines the various schemes available and looks at what products can be used such as thermal bridging blocks to meet the requirements.

By the end of this CPD seminar delegates should have an awareness of:

1. How junction design can contribute to the overall thermal efficiency of a building inasmuch that however good the U values are, if the junction isn't insulated, the design can still fail SAP/SBEM.

2. The issues thermal bridging at the wall-floor junctions can generate: increased energy bills, condensation/mould growth, non-compliance to Part L of the building regulations and climate change.

3. How improving a building element’s U value can increase the risk of thermal bridge heat loss.

4. How to determine where the worst thermal bridges in a building may occur and what measures and products are designed to address them.

5. The various third-part schemes available to be used in designs as alternatives to the old accredited construction details.